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A four band antenna for wireless applications
Antennas have rapidly developed since the introduction of wireless network. With many new wireless standards introduced in each wireless network generation, multi band antennas have been developed to accommodate many standards into a single...
A multimode feed for compact offset parabolic reflector antenna system
In this paper the design of a multimode corrugated feed at centre frequency of 7.25 GHz is presented, which reduces very high level of cross polarization in an offset parabolic reflector antenna system. The higher order modes TE<sub xmlns:m...
A design of miniaturized half-mode SIW cavity backed antenna
A miniaturized half-mode substrate integrated waveguide (HMSIW) antenna is presented which resonates at a frequency of 6.78 GHz. The S-parameters and radiation patterns are investigated by full-wave simulation and the simulated results show...
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Impact of Cu Pad Density on Cu-CMP and Bonding Yield for Chip-to-Wafer Hybrid Bonding
The role of metal density around fiducial marks (used for chip alignment) on the quality of chemical-mechanical-planarization (CMP) of Cu bond-pads/electrodes has been meticulously studied via two different layout designs. A gradual increas...
Creep Behavior of Low-Temperature Sn-In Solder Using Nanoindentation Test
Low-temperature solders are required in three-dimensional integrated circuit (3D ICs) to reduce heat input during soldering and for stacking. Sn-52mass%In alloys (Sn-In alloys) is promising because it has a melting point of 119 °C. However,...
Thermal Analysis of Reflow Process for PIC-Embedded Package Substrate with 2.3D RDL Interposer for Co-Packaged Optics
Toward a next generation co-packaged optics (CPO), we have worked on a novel package substrate in which photonics integrated circuits (PICs) are embedded. The substrate can be provided as known good package substrate with optoelectronic con...