Creep Behavior of Low-Temperature Sn-In Solder Using Nanoindentation Test

Low-temperature solders are required in three-dimensional integrated circuit (3D ICs) to reduce heat input during soldering and for stacking. Sn-52mass%In alloys (Sn-In alloys) is promising because it has a melting point of 119 °C. However, Sn-In alloys may cause significant creep deformation at room temperature. Nanoparticle addition may control creep deformation. This study investigates the creep behavior of Sn-In alloys and tries the creep deformation control by nanoparticle addition. Experimental results showed that The creep deformation of Sn-In alloys is significant compared to other lead free solders, but this study shows that the addition of nanoparticles may improve the creep deformation of Sn-In alloys.