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Cold-sprayed aluminum capacitors on leadframes for 3D power packaging
Size and weight have always been key concerns for power supplies. Today’s approaches of manufacturing integrated power electronics building block modules with the assembly of pre-packaged devices and low-volumetric density capacitors and i...
Power Systems on Chiplet: Inductor-Linked Multi-Output Switched-Capacitor Multi-Rail Power Delivery on Chiplets
The energy demand of future computing introduces new challenges in voltage regulator design. This paper explores an inductor-linked single-input multi-output hybrid switched-capacitor power architecture with modular output cells for 48-V to...
Low-Frequency Power Telemetry Using Multiferroic Laminate Heterostructures
Wireless power transmission is becoming a key technology in realizing future sensor nodes. Current approaches are based on inductive links or RF telemetry, both face limitations in achieving higher power densities. Multiferroic telemetry ca...
Laminate-Embedded Multimodal Energy Harvester for Multilevel Power Supply
A unique, multimodal 3D power packaging concept for simultaneous energy harvesting from RF, Solar, and TEG is proposed and demonstrated. The key innovations are five-fold: 1) 3D vertical stacking with substrate-embedding of RF and solar-TEG...
Class I Multi-Layer Ceramic Capacitors (MLCCs) Performance as Wide Band Gap (WBG) Snubbers in Hard Switching Applications
There is increased interest in packaging snubber capacitors close to Wide Band Gap (WBG) device switches to improve performance, ultimately being most effective packaged inside power modules. The performance of Multi-Layer Ceramics Capacito...
New Design Concepts for PCB-Integration Technology in Power Electronics reducing Circuit Parasitics to a Minimum
With the introduction of fast switching wide-bandgap (WBG) power semiconductors, the focus in the development of power modules has increasingly been shifted to reducing parasitic elements. To fully use the advantages of WBG power semiconduc...
Design Considerations for 48-V VRM: Architecture, Magnetics, and Performance Tradeoffs
The energy demand of future computing gives rise to new challenges in high current voltage regulator modules (VRMs). This paper reviews the recent development in architecture and magnetics for 48-V VRMs, with a focus on achieving high effic...
Laser-induced graphene supercapacitors on flex substrates for package-integrated power supply
Integrated power sources have a critical role in the operation of miniaturized, lightweight, wearable medical and IoT devices. Such power sources should be ideally grown directly on the package substrates for low-impedance power delivery an...
NMOS/NLDMOS LSS dead-time minority carrier isolation optimization
NMOS/NLDMOS LSS dead-time minority carrier isolation is critical for Synchronous Step-down converter products both for reliability and die size cost. We evaluate MAAP isolation ring design effectiveness using TCAD simulation with 1, 10 and ...