Browse Conferences
Advanced Development of Squeeze Effect Non-Contact Handling Tool for Semiconductor Chips
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Face-Down and Heterogeneous Chip Bonding Technology on Waffle-Wafer for Bumpless Chip-an-Wafer (COW) Package
A high-speed, manufacturable, fully chiplet integration process using Face-Down bonding to 300 mm waffle-wafer and bumpless Chip-on-Wafer (COW) has been developed for the first time. The inkjet method successfully formed a thin adhesive lay...
Reliability Analysis of Wireless Power Transfer for Electric Vehicle Charging based on Continuous Markov Process
In this paper, the reliability analysis of wireless power transfer system for charging electric vehicles using Markov process is presented. Since wireless chargers of electric vehicles are supposed to be exposed to various weather condition...
Inverter/converter power density and flexibility improvements through modularity and novel thermal management architecture
This paper explains the technical challenges that come with miniaturization of inverter and converter technology and how Marel addresses these challenges through modularity, specialized manufacturing techniques, and a unique thermal managem...
EMI Shielding Performance of Thin and Thick Graphene Films Placed Within Integrated Power Modules
This paper presents electromagnetic interference (EMI) analysis and the performance of graphene-enhanced shielding. Two types of graphene have practical relevance. The first is synthesized through Chemical Vapor Deposition (CVD) techniques ...
Power Electronic Converters for Wind Power Generation
A detailed assessment of high-power wind energy systems is offered in this work, with an emphasis on electrical technology. The application of power electronics in wind turbine systems is discussed in this study. The use of power electronic...
A Review of Power Electronic Converters for Electric Aircrafts
The vehicular sector is undergoing an electric revolution, and the aircraft industry is expected to be able to embrace fundamental disruption. The impact on the environment, cost savings, maintenance, noise pollution, and safety benefits of...
Wide Band Gap Semiconductor Devices for Power Electronic Converters
Wide Band Gap (WBG) semiconductors provide superior material qualities that could allow for the functioning of prospective power devices at higher temperatures, voltages, and switching rates than is now possible with Si technology. However,...
Overview of Power Electronic Converters in Electric Vehicle Applications
A rapidly growing market of electric vehicles (EVs) has been witnessed in the last decade due to being environmentally friendly, having enough resources, and being cost-efficient. For EV applications, several conductive charging rectifiers,...
Reticular Graphene Reinforced Copper for Electromagnetic Shielding Application
The performance and longevity of smart electrical gadgets are heavily dependent on heat dissipation and electromagnetic (EM) shielding capabilities, which must be solved. The reticulated architecture of Graphene foam (GrF) is adopted for de...