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Packaging Approaches for mm Wave and Sub-THz Communication
This paper presents challenges, opportunities and approaches for packaging at THz frequencies. The two approaches discussed here are laminate based approach and Glass Panel Embedding (GPE). Laminate based solutions provide for low cost and ...
Sub-THz and THz Signal Generation Using Photonic and Electronic Techniques (Invited Paper)
To enable the use of the sub-THz and THz region of the electromagnetic spectrum from 100GHz to 10THz for next generation high-speed wireless communication and other emerging applications, it is important to generate the signal in this frequ...
300-GHz-Band CMOS Transmitter and Receiver Modules with WR-3.4 Waveguide Interface
This paper reviews 300-GHz-band CMOS transmitter (TX) and receiver (RX) modules with a WR-3.4 waveguide interface that allows a high-gain antenna or some other component like an amplifier to be connected. A TX or RX chip fabricated using a ...
W-band PAM-4 wireless delivery employing intensity modulation and coherent detection based on CMMA equalization
We have experimentally demonstrated PAM-4 signals generation and millimeter wave wireless transmission at 90-GHz W-band, respectively, enabled by using an intensity modulator and coherent receiver. The bit-error-ratio (BER) performance can ...
Reliable Multi-user Uplinks in Fiber-Wireless Integrated Network using Quasi-orthogonal Chirp Spreading OFDM
We experimentally demonstrate a grant-free multiuser upstream with a quasi-orthogonal chirp spreading (QOCS) orthogonal frequency division multiplexing (OFDM) in an intensity-modulation and direct-detection based fiber-wireless convergence ...
Towards Dynamic 5G Networks Utilizing Flexible Function Split
The migration of wireless mobile networks from the relatively limited microwave radio spectrum to the “all-spectrum” principle of communication, which aims to make use of microwave and millimeter wave mobile networks as well as fixed poin...
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