A Novel Direct Transfer Bonding Process with Particle Less Tapes for Die to Wafer Integration

Die-to-wafer (D2W) technology is expected to be a key method of 3D/heterogeneous integration. Direct Transfer Bonding (DTB) was developed to solve accuracy and throughput due to chip-level handling in D2W. In this paper, Novel DTB, DTB using particle less tapes process is presented. Main results showed that novel DTB is improved in terms of bonding failure chips and void areas after DTB.