Impact of 2-Dimensional Materials for 3D Power IC

3D power ICs that stack Si-LSI and GaN power devices three dimensionally are promising candidates for next generation power ICs, primarily because they can minimize the power supply and realize high efficiency. However, miniaturization increases the heat generation density. One of the key problems associated with 3D power ICs is how to remove the heat. Multilayer graphene has high thermal conductivity and excellent heat removal performance. One of the most effective ways to remove heat is to directly remove it from the semiconductor chip, which is the source of heat, using multilayer graphene. In this paper, we clarify the role of multilayer graphene as a thermal interface material (TIM) and heat removal effect of multilayer graphene in 3D power ICs using thermal simulation. In addition, we propose the optimum structure using multilayer graphene, TV, h-BN, and SOI technology to realize 3D power ICs.