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W. Blood
Also published under:
Affiliation
SPS, Motorola, Inc., Tempe, AZ, USA
Topic
Electromagnetic Simulation,Finite Element Method,Geometric Parameters,Metal Thickness,Quality Factor,Acoustic Waves,Assembly Operations,Bond Wires,Boundary Element Method,Box-Behnken Design,Capacitive Coupling,Compact Model,Complex Propagation,Conductive Metal,Conventional Packaging,Dielectric Constant,Discrete Variables,Dual Band,Electrical Performance,Electromagnetic Field,Electromagnetic Interaction,Equivalent Circuit Model,Equivalent Impedance,Feed Line,Filtration Performance,Finite Thickness,Flexible Design,Form Factor,High-density Interconnect,Impedance,Insertion Loss,Linewidth,Low Quality Factor,Low-noise Amplifier,Main Resonance,Matching Network,Material Parameters,Material Properties,Mathematical Representation,Measurement Data,Metallic Ground,Microstrip,Microwave System,Mirror Symmetry,Model Parameters,Number Of Loops,Numerical Techniques,Octagonal,Organic Substances,Output Filter,
Biography
Li Li (M'95–SM'03) received the Ph.D. degree in electrical engineering from the State University of New York at Binghamton, Binghamton, NY, in 1995.
She is currently a Distinguished Member of Technical Staff at Freescale Semiconductor, Inc. in Tempe, AZ. Since 1993, she has worked on various areas of packaging material and process development. She is currently involved in RF module development, integrated passives design and simulation on SiGe substrate and organic substrate, and flip-chip introduction in RF modules. She has published more than 40 technical papers, and she has three issued US patents in the electronic packaging area.
Dr. Li was awarded the IEEE CPMT Society's “Outstanding Young Engineer Award” for the year 2002 (co-winner). She won the first Motorola-IEEE CPMT Society Graduate Fellowship Award for Research on Electronic Packaging in 1993.
William Blood recently retired after a 36-year career with Motorola. His last position at Motorola used EM simulation to develop and model embedded passive devices for RF integrated circuits. During his time at Motorola, he wrote over 70 technical papers, authored the MECL System Design Handbook, and received four patents.
She is currently a Distinguished Member of Technical Staff at Freescale Semiconductor, Inc. in Tempe, AZ. Since 1993, she has worked on various areas of packaging material and process development. She is currently involved in RF module development, integrated passives design and simulation on SiGe substrate and organic substrate, and flip-chip introduction in RF modules. She has published more than 40 technical papers, and she has three issued US patents in the electronic packaging area.
Dr. Li was awarded the IEEE CPMT Society's “Outstanding Young Engineer Award” for the year 2002 (co-winner). She won the first Motorola-IEEE CPMT Society Graduate Fellowship Award for Research on Electronic Packaging in 1993.
William Blood recently retired after a 36-year career with Motorola. His last position at Motorola used EM simulation to develop and model embedded passive devices for RF integrated circuits. During his time at Motorola, he wrote over 70 technical papers, authored the MECL System Design Handbook, and received four patents.