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- Computing and Processing
- Components, Circuits, Devices and Systems
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- General Topics for Engineers
- Fields, Waves and Electromagnetics
- Engineered Materials, Dielectrics and Plasmas
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Azman Jalar
Also published under:A. Jalar
Affiliation
Institute of Microengineering and Nanoelectronics, Universiti Kebangsaan Malaysia (UKM), Selangor, Malaysia
Topic
Intermetallic,Thermal Expansion,Ball Grid Array,Scanning Electron Microscopy,Solder Joints,Bond Strength,Contact Resistance,Solar Panels,Thermal Test,Thin-film Solar Cells,Atomic Force Microscopy,Back Contact,Bipolar Transistor,Bond Wires,Confidence Level,Depth Profile,Dye Penetration,Failure Mechanism,Four-point Probe,Layered Compounds,Null Hypothesis,One-way ANOVA,Paired Samples,Peel Strength,Peel Test,Printed Circuit Board,Resistance Values,Sonotrode,Test Method,Thermal Cycler,Thermal Load,Tukey Pairwise Comparisons,Ultrasonic,Window Parameters,3D Laser Scanning,3D Laser Scanning Microscope,3D Microscopy,3D Scanning,Acceleration Voltage,Al Bond,Alloying Elements,Aluminium Alloy,Aluminum Metal,Array Of Components,Assembly Line,Assembly Process,Average Expansion,Average Profile,Back Contact Layer,Bias Voltage,
Biography
Azman Jalar received the B.Sc. (Hons.) degree in materials science from Universiti Kebangsaan Malaysia (UKM), in 1995, and the Ph.D. degree from the University of Birmingham, U.K., in 2001. He is currently the Deputy Director of the Institute of Microengineering and Nanoelectronics, UKM, and an Associate Professor.