Topic
- Computing and Processing
- Components, Circuits, Devices and Systems
- Communication, Networking and Broadcast Technologies
- Power, Energy and Industry Applications
- Signal Processing and Analysis
- Robotics and Control Systems
- General Topics for Engineers
- Fields, Waves and Electromagnetics
- Engineered Materials, Dielectrics and Plasmas
- Bioengineering
- Transportation
- Photonics and Electrooptics
- Engineering Profession
- Aerospace
- Geoscience
- Nuclear Engineering
- Career Development
- Emerging Technologies
- Telecommunications
- English for Technical Professionals
Manish Arora
Affiliation
Advanced Micro Devices, Inc., AMD Research
Topic
Data Center,Average Temperature,Cost Savings,Heat Sink,Load Level,Melting Temperature,Paraffin Wax,Peak Hours,Peak Load,Phase Change Materials,Reduction Peak,Thermal Storage,Thermocouple,ANSYS Fluent,Additional Jobs,Airflow,Batch Mode,Benchmark,Boiling,Cluster Level,Computational Workload,Data Cache,Degree Of Coupling,Density Of The System,Design Space Exploration,Electronic Components,Energy Density,First Law Of Thermodynamics,Frequency Sensitivity,Heat Flux,Heat Of Vaporization,Heat Source,Heat Storage,Heat Transfer Enhancement,High Loading Values,High Packing Density,Highest Frequency,Hot Air,Immersion Cooling,Impact Of Density,Increase In Power,Increase In Throughput,Job Placement,Law Of Thermodynamics,Liquid Temperature,Loading Values,Lookup Table,Low Load,Lowest Temperature,Maximum Temperature,
Biography
Manish Arora is a member of the technical staff at AMD Research and a PhD candidate in the Computer Science and Engineering Department at the University of California San Diego. His research interests include CPU-GPU systems, thermal management, and enabling computational density in systems. Arora has a MS in computer engineering from the University of Texas at Austin. Contact him at [email protected].