Özgür Ergül

Also published under:O. Ergul, ÖzgÜr Ergul, Ö Ergül, Özgür Ergul, Ozgur Ergul, Özgülr Ergül, Özgüxr Ergül, Özgiir Ergül, O. Ergül, Ozgr Ergul

Affiliation

Department of Electrical and Electronics Engineering, Middle East Technical University, Ankara, Turkey

Topic

Electric Field Strength,Integral Equation,Fitness Function,3D Printing,Co-formulated,Electric Field Integral Equation,Broadband,Closed Surface,Dielectric Constant,Dielectric Rod,Dielectric Slab,Electric Current Density,Genetic Algorithm Optimization,Internal Resonance,Iterative Solver,Matrix Inequalities,Matrix Multiplication,Mesh Size,Method Of Moments,Polylactic Acid,Radiation Pattern,Rod Array,3D Printing Filaments,3D Printing Materials,3D Simulation,5G Applications,5G Mobile Networks,Acceleration Method,Accurate Solution,Acrylonitrile Butadiene Styrene,Addition Operations,Air Holes,Auxiliary Parameters,Backscattering Reduction,Beam Propagation,Beam Splitter,Beampattern,Beamwidth,Bidirectional Pattern,Bottom Surface,Box Size,Calibration Process,Center Of The Sphere,Characterization Setup,Circular Cavity,Combination Of Algorithms,Combination Of Genetic Algorithm,Common Architecture,Composite Filaments,Computational Platform,

Biography

Ozgur Ergul [S'11, M'16] received his Ph.D. degree in electrical and electronics engineering from Koc University, Turkey, in 2015. He is currently a post-doctoral research fellow in the Next-Generation and Wireless Communication Laboratory, Koc University. His research interests include nanoscale communications, cognitive radio networks, next-generation wireless communications, sensor networks, and the Internet of things.