Topic
- Computing and Processing
- Components, Circuits, Devices and Systems
- Communication, Networking and Broadcast Technologies
- Power, Energy and Industry Applications
- Signal Processing and Analysis
- Robotics and Control Systems
- General Topics for Engineers
- Fields, Waves and Electromagnetics
- Engineered Materials, Dielectrics and Plasmas
- Bioengineering
- Transportation
- Photonics and Electrooptics
- Engineering Profession
- Aerospace
- Geoscience
- Nuclear Engineering
- Career Development
- Emerging Technologies
- Telecommunications
- English for Technical Professionals
Muhannad S. Bakir
Also published under:M. S. Bakir, Muhannad Bakir, M. A. Bakir, M. Bakir
Affiliation
School of Electrical and Computer Engineering, Georgia Institute of Technology, Atlanta, GA, USA
Topic
Heterogeneous Integration,Flip-chip,Heat Spreader,Thermal Expansion,3D Integration,Coplanar Waveguide,Electrical Interconnection,Electron Beam Lithography,Junction Temperature,Power Density,Thermal Conductivity,Thermal Resistance,3D Heterogeneous Integration,Alignment Accuracy,Atomic Layer Deposition,Commercial Off-the-shelf,Hardware Accelerators,Heat Transfer Coefficient,High-density Integration,High-performance Computing,Inference Accuracy,Low-noise Amplifier,Optical Fiber,Optical Interconnects,Parasitic Capacitance,Peripheral Circuits,Photonic Integrated Circuits,Power Delivery,Power Delivery Network,Process Flow,Random Access Memory,Resistive Random Access Memory,Static Random Access Memory,Thermal Interface Materials,Thermal Performance,Thermal Simulation,Vertical Gap,3D Architecture,3D Printing,3D Technology,Accuracy Drop,Advanced Architectures,Analog Domain,Architectural Integrity,Architectural Perspective,Aspect Ratio,Assembly Technology,Average Power Consumption,Average Resistance,Balanced Design,
Biography
Muhannad S. Bakir (S’98–M’03–SM’12) received the B.E.E. degree from Auburn University, Auburn, AL, USA, in 1999, and the M.S. and Ph.D. degrees in electrical and computer engineering from the Georgia Institute of Technology (Georgia Tech), Atlanta, GA, USA, in 2000 and 2003, respectively.
He is currently a Professor with the School of Electrical and Computer Engineering, Georgia Tech. His current research interests include 3-D electronic system integration, advanced cooling and power delivery for 3-D systems, biosensors and their integration with CMOS circuitry, and nanofabrication technology.
Dr. Bakir was a recipient of the 2013 Intel Early Career Faculty Honor Award, the 2012 DARPA Young Faculty Award, and the 2011 IEEE CPMT Society Outstanding Young Engineer Award, and was an Invited Participant in the 2012 National Academy of Engineering Frontiers of Engineering Symposium. In 2015, he was elected by the IEEE CPMT Society to serve as a Distinguished Lecturer. He and his research group have received more than 20 conference and student paper awards, including five from the IEEE Electronic Components and Technology Conference, four from the IEEE International Interconnect Technology Conference, and one from the IEEE Custom Integrated Circuits Conference. His group was a recipient of the 2014 Best Paper of the IEEE Transactions on Components, Packaging, and Manufacturing Technology in the area of advanced packaging. He is an Editor of the IEEE Transactions on Electron Devices and an Associate Editor of the IEEE Transactions on Components, Packaging, and Manufacturing Technology.
He is currently a Professor with the School of Electrical and Computer Engineering, Georgia Tech. His current research interests include 3-D electronic system integration, advanced cooling and power delivery for 3-D systems, biosensors and their integration with CMOS circuitry, and nanofabrication technology.
Dr. Bakir was a recipient of the 2013 Intel Early Career Faculty Honor Award, the 2012 DARPA Young Faculty Award, and the 2011 IEEE CPMT Society Outstanding Young Engineer Award, and was an Invited Participant in the 2012 National Academy of Engineering Frontiers of Engineering Symposium. In 2015, he was elected by the IEEE CPMT Society to serve as a Distinguished Lecturer. He and his research group have received more than 20 conference and student paper awards, including five from the IEEE Electronic Components and Technology Conference, four from the IEEE International Interconnect Technology Conference, and one from the IEEE Custom Integrated Circuits Conference. His group was a recipient of the 2014 Best Paper of the IEEE Transactions on Components, Packaging, and Manufacturing Technology in the area of advanced packaging. He is an Editor of the IEEE Transactions on Electron Devices and an Associate Editor of the IEEE Transactions on Components, Packaging, and Manufacturing Technology.