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V. Hause
Also published under:
Affiliation
Semiconductor Products Sector, Motorola, Inc., Tempe, AZ, USA
Topic
Junction Temperature,Thermal Performance,Thermal Resistance,Airflow,Ambient Levels,Ambient Pressure,Atomic Force Microscopy,Boiling Heat Transfer,Bulk Liquid,Cell Phone,Coating Thickness,Condensation,Conductive,Contact Resistance,Critical Heat Flux,DC Function,Degassed,Differences In Strength,Discrete Packages,Distinct Features,Electronic Packaging,Etching Process,Failure Analysis,Failure Modes,Field-effect Transistors,Fracture Strain,Free Air,GaAs Substrate,Heat Dissipation,Heat Flux,Heat Spreader,Heat Transfer,Heterogeneous Integration,High Power Density,High Strength,Hot Spots,Hot Temperature,Impedance,Increase In Power,Infrared Imaging,Internal Pressure,Low Contact Resistance,Manometer,Maximum Power,Maximum Temperature,Mechanical Grinding,Micro-electromechanical Systems Switch,Part Of Package,Perfluorocarbon,Poor Conductivity,
Biography
Vern Hause is a Distinguished Member of the Technicians Technical Ladder, Motorola's Final Manufacturing Technology Center, Tempe, AZ. He joined Motorola in 1979 and has been involved in supporting design engineers in the thermal and mechanical design of electronic packaging for over 14 years. He holds four patents. He manages thermal and mechanical characterization projects in both labs, has conducted thermal and mechanical characterization on countless electronic packages and materials, and developed various experimental techniques that include high-speed infrared thermal imaging and parametric thermal analyses in the thermal arena as well as special four point bend, ball breaker stress tests, and bonding wire stress tests in the mechanical arena. He has also co-authored 13 conference and journal papers.