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Craig Amrine
Also published under:C. Amrine
Affiliation
Freescale Semiconductor, Inc., Tempe, AZ, USA
Topic
Chip Packaging,Flip-chip,Metal Layer,Pack Size,Power Amplifier,Power Management,Printed Circuit Board,Thermal Performance,Digital Signal Processing,Drop Test,Heat Spreader,High-temperature Storage,Reliability Test,Signaling Routes,Thermal Resistance,Bond Wires,Broad Range Of Systems,Delamination,EM Simulation,Energy Release Rate,Forced Convection,Fracture Toughness,Ground Plane,Heat Sink,Natural Convection,Thermal Expansion,Cell Phone,Coating Thickness,Compatible Devices,Conductive,Contact Resistance,DC Function,Dielectric Layer,Discrete Packages,Field-effect Transistors,Finite Element Method,Finite-difference Time-domain,Flat Panel,GaAs Substrate,Heat Dissipation,High Power Density,Hot Spots,Hot Temperature,Impedance,Infrared Imaging,Junction Temperature,Low Contact Resistance,Maximum Temperature,Micro-electromechanical Systems Switch,Moisture Sensitivity,
Biography
Craig Amrine received the B.S. degree in ceramic engineering from Alfred University, Alfred, NY.
He has explored careers in the fields of glass/ceramic materials development, field-emission display development, and semi-conductor packaging. He currently holds 16 patents within these fields and has several additional patents pending.
He has explored careers in the fields of glass/ceramic materials development, field-emission display development, and semi-conductor packaging. He currently holds 16 patents within these fields and has several additional patents pending.